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Nikon Undercuts ASML on ArF Lithography: Intel Seals $3.3B India Glass Substrate Deal

Nikon ASML lithography competition intensified on May 29 as CEO Yasuhiro Ohmura announced lower-priced ArF immersion tools to challenge ASML's 80%-plus market share, while Intel and 3D Glass Solutions signed a $3.3 billion glass-core substrate deal with India's Odisha government, targeting production by 2028 and reshaping Samsung and SK hynix's AI packaging race.

Tech
Dutch Minister: ASML Export License Denials Linked to Fears of Chinese Military Integration
by Quincy Jon
Tech
Netherlands Blocks ASML From Exporting Some Chipmaking Tools to China After US Export Restrictions
by Jace Dela Cruz
Tech
ASML Considers Building Plants in Southeast Asia to Reduce Exposure to China
by Inno Flores
Tech
Netherlands to Block Semiconductor Technology Exports Amid the US-China Chip War
by Inno Flores
Tech
ASML Discovers Former Chinese Employee Has Allegedly 'Misappropriated' Chip Data
by Joseph Henry
Tech
ASML Forecasts Sales Recovery in 2023 and Revenue Stability in China
by Trisha Kae Andrada
Tech
US-China Tech War: ASML, Lam Research Pulls American Engineers From China Amid New Chip Restrictions
by Joaquin Victor Tacla
Tech
ASML Warns That Chip Ban Against China Will Be Disruptive to the Global Supply Chain
by April Fowell
Tech
ASML Accuses Chinese Tech Firm of Stealing Company Secrets | Engineer Behind IP Theft
by Joseph Henry

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