AMD gets mixed in on the recent leak involving its EPYC chip that will be getting a new 3D die stacking technology feature. According to the GPU leakers, the company is now embracing a group of new-age processors that will be centered on the Milan-X series variant.

AMD Rumors Circling EPYC Milan-X Processor

(Photo : Timothy Dykes from Unsplash)
AMD EPYC Milan-X is believed to feature a new 3D die technology.

According to the latest report of Tom's Hardware on Wednesday, May 26, Patrick Schur and ExecutableFix tweeted that AMD is now getting a headstart on its preparation for the release of its new data center processors.

We can recall that the Santa Clara-based semiconductor maker first teased their forthcoming chip will be creating waves through its X3D Chip Packaging Technology. During the Financial Analyst Day last year, fans have been craving AMD's updates about the hybrid feature that the next chips will receive.

The X3D feature will make use of the 3D die stacking and 2.5D packaging. To put it simply, the 3D stacking will allow the chip to "stack" several dies on top of one another. They will be included inside the multi-chip modules (MCM) of AMD.

Two years ago, Intel surprised CPU fans with its Foveros 3D stacking technology which provides high-speed communication among the chips. The X3D stacking could be the answer to AMD to Intel's Embedded Multi-Die Interconnect Bridge (EMDIB).

Read Also: [RUMOR] AMD Zen 4 EPYC CPU Specs Revealed: 96-Core Processor Will Offer 192 Threads and MORE!

While we assume that the company is now sure to launch the 3D stacking feature, the leaks revealed that it would arrive in Milan-X CPU. The said chip appears to be similar to the EPYC 7003 since it also has Zen 3 cores which make it a perfect candidate for the new trademark.

According to ExecutableFix, the Genesis IO-die will be the basis for the Milan-X which covers the Zen 3 EPYC I/O die set up inside.

Even though AMD mentioned something about X3D's higher bandwidth for 10X, the Milan-X has yet to unlock other important characteristics during the presentation. The chipmaker remains silent about its "future" plans for the stack technology.

ExecutableFix lays out his assumption that AMD will be piling the chiplets up. However, it could not happen to the core complex dies (CCDs) if we consider the requirement of its cooling.

More About What Milan-X Could Possess

As the Computex 2021 nears, the suspicion that AMD EPYC Milan-X will adopt the dies could be the other way around since it will potentially come out as a stacking memory.

Moreover, the Financial Analyst Day 2020 exhibit presented a 2x2 layout of AMD along with four stacked dies placed above the huge interposer aided with four interlinked small chips.

The leakers predicted that the dies will be the four chiplets. The addition of the HBM memory could also spell some nice improvement for the EPYC chip. This will suit its function of carrying out many tasks that are all bandwidth-sensitive, Extreme Tech reported.

AMD CEO Dr. Lisa Su calls the X3D processor the "future." Although the news about the Milan-X chip is far from being heard, we could expect some great news in the upcoming annual event in Taipei.

Related Article: EPYC Performance: AMD's Leaked Roadmap for Server CPUs Teases A 96-CORE MONSTER

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Writen by Joseph Henry